The World’s Most Powerful Heatsink for Extreme CPU Cooling with Diabatix Gen-AI Technology and 3D Systems Metal 3D Printing

We are proud to announce that our cutting-edge technologies have led to the development of the world's most powerful AI-designed and metal 3D printed liquid nitrogen (LN2) heatsink for extreme CPU cooling. This groundbreaking innovation was developed at the request of the renowned overclocking experts from SkatterBencher and ElmorLabs. Through this innovation we have set a new benchmark in thermal management.

Extreme CPU cooling using liquid nitrogen is becoming the standard for computer overclocking as it allows for extremely low temperatures that are required to enable the desired extreme clock speeds. By leveraging the cutting-edge capabilities of Diabatix’ ColdStream platform, the engineering team has generated a heatsink that redefines thermal performance of liquid nitrogen cooling.

By utilizing two-phase boiling physics in combination with some of the most sophisticated algorithms in the world, ColdStream generated a structure that maximizes heat transfer to the extreme while leveraging the capabilities of 3D printing manufacturability. Initial tests have demonstrated extraordinary results with a thermal resistance as low as 0.011K/W. That is 1.1°C of temperature difference between the heatsink base and the liquid nitrogen per 100W of CPU power, positioning it as one of the most powerful heatsinks in the world.

The heatsink was created using 3D Systems' Direct Metal Printing technology, utilizing certified oxygen-free copper for superior thermal conductivity of 390 W/mK. This cutting-edge approach allows for geometries that traditional manufacturing methods cannot achieve to produce components optimized for performance.

Maintaining the purity of the copper powder during printing is of utmost importance as any oxygen in the copper matrix has a detrimental effect on its thermal conductivity. 3D Systems’ unique vacuum chamber concept allows for a vacuum precycle prior to the printing job which actively removes air and moisture from the build chamber and the powder. After this cycle the chamber is filled with high-purity argon gas. This highly efficient and effective vacuum pre-cycle helps achieve an extremely low oxygen environment. Furthermore, the vacuum chamber’s leak-tight design ensures that no oxygen can leak into the build chamber and results in exceptionally low argon consumption during printing. This vacuum chamber concept helps to eliminate the risks for oxygen pick up by the powder feedstock, resulting in stable powder chemistry and a significant enhancement of the Certified Oxygen-Free Copper powder batch reusability.

Following its development, the LN2 heatsink underwent initial physical testing by ElmorLabs to validate its performance. The detailed initial evaluation confirms the predicted heatsink's exceptional cooling capabilities. In particular, the 3x faster cooldown behavior compared to the Volcano LN2 cooler, one of the top products in the market today, stood out during testing. Because the AI design and the Volcano have an identical mass of 1.7 kg and both use copper as the base material, this difference can only come from improved heat transfer at the surface and better heat transport inside the copper.

The tests demonstrated that the LN2 container can easily handle the Core i9-14900KF with P-cores clocked up to 7.5 GHz, consuming 600W of power. With a heatsink base temperature difference of 11°C compared to the Volcano LN2 cooler, compared to a total heat up of only 9°C(!), the AI design proves to have the potential to carry more than twice as much power for the same base temperature. The AI design therefore passes the tests with flying colors, and with a huge margin left on reaching higher powers.

This pioneering project was initiated at the request of SkatterBencher and ElmorLabs, both leading authorities in the overclocking community. Their expertise and insights were instrumental in guiding the development process. Their ambition aligns very well with our commitment to pushing the boundaries of what is possible in thermal management. This revolutionary LN2 heatsink is a clear example of our dedication to leveraging our technology to create groundbreaking solutions. We are thrilled to introduce this world-class product and the new standard it sets in the industry. Yet, the current design is only the starting point of the collaboration. While preparing the supply chain for the commercialization of the product, we are already preparing additional variants. At the top of the target list is to go beyond the 2000W mark in physical tests. To be continued!

Founded in 2016, Diabatix is at the forefront of generative AI for thermal management. Their cloud-based ColdStream platform empowers engineers to optimize designs for maximum heat transfer and efficiency, reducing material usage and engineering time. Serving clients across various sectors, including automotive, high-performance computing, and aerospace, Diabatix is dedicated to revolutionizing thermal management with cutting-edge technology. https://diabatix.com

ElmorLabs Ltd is a design firm specializing in products for PC overclocking and DIY enthusiasts. The company oversee all stages of product development, from conception to packaging. Their core expertise lies in electronic hardware, firmware, and software design, ensuring comprehensive solutions tailored to the needs of their customers. https://elmorlabs.com/

SkatterBencher is a trusted resource for hardware performance enthusiasts. The company empowers readers with in-depth knowledge of CPUs, GPUs, APUs, and SoCs through meticulously documented experiments and comprehensive guides. Their mission goes beyond breaking benchmark performance records. By pushing the limits of technology, they unlock greater performance potential and develop a better understanding of hardware architectures, cooling methods, and total system optimization strategies. https://skatterbencher.com/

More than 30 years ago, 3D Systems brought the innovation of 3D printing to the manufacturing industry. Today, as the leading AM solutions company, it empowers manufacturers to create products and business models never before possible through transformed workflows. This is achieved with the company’s best-of-breed digital manufacturing ecosystem - comprised of plastic and metal 3D printers, print materials, on-demand manufacturing services and a portfolio of end-to-end manufacturing software. Each solution is powered by the expertise of the company’s application engineers who collaborate with customers to transform manufacturing environments. 3D Systems’ solutions address a variety of advanced applications for prototyping through production in markets such as aerospace, automotive, medical, dental and consumer goods. https://3Dsystems.com