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Directly impacting the efficiency and yield of semiconductor manufacturing processes, wafer tables’ precision and reliability is critical in semiconductor manufacturing equipment. Through design for additive manufacturing (DfAM), it’s possible to optimize internal cooling channels and surface patterns, thus dramatically improving surface temperatures and thermal gradients while reducing time constants. With unique designs attainable only with additive manufacturing, it is possible to efficiently dissipate heat, increase reliability through structural optimization, enhance system throughput and accuracy, and improve overall performance.
Participate to this webinar to learn how our complete ecosystem enables the creation of optimized metal components such as this advanced wafer table to:
- Increase efficiency - Optimally design, rapidly iterate, and manufacture optimized cold plates to improve high quality semiconductor chips yield within each wafer.
- Improve reliability – Replacing multipart assemblies with monolithic additively manufactured parts increases reliability, improves manufacturing yield, and reduces labor costs.
- Reduce lead-time and minimized supply chain challenges.
- Access to metal additive manufacturing experts to develop optimized components and through expert-led technology transfer.