Manufacturing Technology Conference

Additive Manufacturing Solutions for Semiconductor Capital Equipment

The ongoing challenge of the semiconductor shortage is a complex supply chain issue that starts at the top with fabrication equipment. Additive manufacturing (or 3D printing) can help semiconductor capital equipment manufacturers overcome global shortages while accelerating innovation to keep pace in one of the most rapidly evolving industries.

Our metal 3D printing solutions remove the limitations of traditional manufacturing workflows and improve metal components design and performance. Innovations include:

• Maximized heat transfer efficiency (i.e. wafer tables thermal management, linear stages cooling)
• Optimized fluid flow for components such as showerheads, manifolds, mixers and feeders
• Improved kinematic and static performance of structural components like flexures, brackets and mounts
• Reduced mechanical disturbances and vibrations
• Consolidated multipart assemblies into monolithic parts
• Improved accuracy, speed, uptime, and throughput

Meet with our experts to take full advantage of metal 3D printing and improve the performance, productivity, and reliability of your semiconductor manufacturing equipment with advanced additive manufacturing solutions, consultancy, and technology transfer. 

Visit us at Manufacturing Technology Conference to discover our latest applications advancements for semiconductor capital equipment and discuss your specific needs.