Download Application Brief
Maximizing heat transfer within a limited footprint often requires structures that are more complex than conventional manufacturing can produce. Additive manufacturing (AM) offers unparalleled benefits to these types of applications by allowing better control over thermal management. For machinery with high accuracy requirements such as semiconductor equipment, these benefits offer opportunities to advance performance of wafer tables.
Wafer tables produced using AM can be designed to answer the final function they need to perform rather than for the production process that will make them a reality. This means previously challenging or impossible features such as thin walls and computer-generated, optimized cooling channel designs can now be produced. This application brief discusses how additive manufacturing can be used to optimize wafer tables, along with a clear explanation of the AM workflow and best practices.
Download the application brief to learn:
- The benefits of using additive manufacturing for wafer tables
- Design for additive tips
- Critical success factors when bringing on additive manufacturing