Reduce Weight, Minimize Vibration, and Consolidate Parts for Increased Reliability, Improved Manufacturing, and Yield
>50%
weight reduction in flexures
23%
higher resonant frequency and reduced system vibration

Create Structurally Optimized and Lightweight Advanced Flexure Designs

semiconductor conventional flexure kinematics image

Part courtesy of VDL

Additive manufacturing allows for the structural optimization and light-weighting of advanced flexure designs that reduce weight and minimize vibration to meet the exacting requirements of semiconductor capital equipment. Additionally, multipart assemblies can be replaced with monolithic parts for increased reliability, improved manufacturing, and yield.  

With years of application engineering experience in the semiconductor industry, we can help you optimize the structural designs of flexures, advanced motion mechanisms, and components. Additive manufacturing gives designers the flexibility to optimize the structural topology of your part (i.e., lightweighting) with a suite of high-strength metal alloys. These designs can meet the performance requirements of semiconductor capital equipment more precisely, improve the strength-to-weight ratio, and deliver a faster time to market. With our metal additive solutions, you can also avoid traditional complex manufacturing assembly by consolidating several parts into one, which improves yield and reliability and reduces labor and inspection costs. 

The Benefits of Metal Additive Manufacturing

  • Semiconductor DMP Manifold in 3DXpert

  • Design Flexibility ‘Function over Form’

    Additive manufacturing makes it possible to optimally design, rapidly iterate, and manufacture lightweight, topology-optimized flexures much closer to the ideal kinematics required with fewer unwanted degrees of freedom.
  • a person in protective gear holding a 3D printed part

  • High Quality and Accuracy for Clean Room Environments

    Our metal additive manufacturing solutions ensure high material quality and part accuracy, producing parts in an inert atmosphere with a steady, ultra-low oxygen level—coupled with proprietary processes for optimal particle cleanliness. This results in metal parts that meet cleanroom requirements and are fit for use in lithography equipment.
  • Flexure Demonstrator Image for Semiconductor

  • Performance and Productivity

    Light-weighting semiconductor components and advanced motion mechanisms reduces inertia and improves lithography and wafer processing machine speed and uptime, leading to more wafers processed. Additive manufacturing also delivers structurally optimized flexures with reduced part counts and assemblies. Replacing multipart assemblies with monolithic parts increases reliability, improves manufacturing yield, and reduces labor costs.

Answer Challenges Related to Flexure and Structural Optimization

  • Silicon Wafers and Microcircuits sitting on a robot arm

    Reduce Vibration, Hysteresis and Inertia to Improve Cycle Time

    Semiconductor capital equipment features fast-moving mechanisms and components, and unnecessary weight can induce vibration, resonance, and inertia into the system, which negatively affects system accuracy and speed.

  • semiconductor vdl focus stack flexure structural optimization image

    Optimized Strength-to-Weight Ratios

    Reducing flexure weight and vibration requires designs with optimal strength-to-weight ratios to deliver exceptional system performance.

    Part courtesy of VDL

  • semiconductor conventional flexure kinematics image

    Advanced Flexure Kinematics

    Conventional flexures can be bulky and still deviate from the ideal kinematics, resulting in accuracy deviations and crosstalk.

    Part courtesy of VDL

Resources

  • 3D Systems Semiconductor Flexure Banner

    Structurally Optimizing Flexures with Additive Manufacturing

    Adding flexures within brackets can help precision systems attain peak accuracy. Discover how additive manufacturing makes producing flexures attainable, along with a clear explanation of the flexure manufacturing workflow and best practices.

    Read the Brief
  • Semiconductor ebook cover

    Rapidly Adopt and Scale Metal Additive Manufacturing

    In this eBook, you’ll learn how 3D Systems’ decades of experience and expertise helps integrate metal AM to drive performance, productivity, and reliability improvements for semiconductor capital equipment manufacturers and suppliers.

    Get the eBook
  • Silicon Wafers and Microcircuits sitting on a robot arm

    Additive Manufacturing for Semiconductor Capital Equipment

    Discover how 3D Systems’ metal additive manufacturing can give semiconductor capital equipment manufacturers and suppliers the capabilities they need to improve performance, productivity, and reliability.

    Read our Brochure

More Semiconductor Applications

hand holding a dmp manifold fluid flow optimization image alt

Manifold Fluid Flow Optimization
semiconductor wafer table thermal management link

Wafer Table Thermal Management

Linear Stage Cooling

Showerhead Optimization

Gas Conveyance and Mixing

Learn More About Flexure and Structural Optimization 3D Printers and Materials

DMP Factory 350 Duel 3D Printer

DMP Factory 350 and DMP Factory 350 Dual

Scalable, high quality metal AM with integrated powder management

DMP Flex 350 Duel 3D printer

DMP Flex 350, DMP Flex 350 Dual and DMP Flex 350 Triple

Robust, flexible metal 3D printer for rapid part production

LaserForm Ti Gr5 (A)

High strength, low weight, excellent biocompatibility

3D Systems 3DXpert hero image

3DXpert

All-in-One Integrated Software for Industrial Additive Manufacturing

Manufacture metal parts with scalable DMLS with removable build chamber for continuous printing

DMP Factory 500

Robust, high quality metal AM with integrated powder management

LaserForm Ti Gr23 (A)

High strength, low weight, excellent biocompatibility - lower Oxygen than Gr5

LaserForm Ni718 (A)

Oxidation, corrosion and extremely high-temperature resistant

LaserForm Ni625 (A)

Excellent corrosion resistance, high strength and heat resistance

LaserForm AlSi10Mg (A)

Good mechanical properties and good thermal conductivity

LaserForm AlSi7Mg0.6 (A)

Light weight, good mechanical properties and improved thermal conductivity

Certified Scalmalloy (A)

High strength aluminum with excellent corrosion resistance

LaserForm 316L (A)

Able to be sterilized and highly corrosion resistant.

DMP Monitoring

Real-time process monitoring for informed decisions on product quality

a 3D rendering made from Control X software

Geomagic Control X

3D Inspection and Metrology Software

Geomagic Design X reverse engineering and 3D scanning software

Geomagic Design X

Reverse Engineering Software

Talk to an Expert

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  • Application Innovation Group

    Our team can help you solve your most difficult design and production challenges with additive manufacturing solutions. Together we’ll identify your needs, working with you to optimize your designs, prototype, validate and define a manufacturing flow.
    Find out more